ASROCK H510 Pro BTC+ Manual Del Usuario página 8

1.2 Specifications
Platform • Solid Capacitor design
CPU • Supports 10
• Digi Power design
• 4 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
Chipset • Intel® H510
Memory • 1 x DDR4 DIMM Slot
* 2GB DRAM per module is not supported.
• Supports DDR4 3200/2933/2800/2666/2400/2133 non-ECC,
* 11
Core
* 10
Core
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
• Max. capacity of system memory: 32GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
Expansion • 6 x PCI Express 3.0 x16 Slots (PCIE1 at x16 / PCIE2~6 at x1)
Slot • 1 x Mining Port (M_Port1 at x1)*
* Support USB Type Riser kit
Graphics • Intel® UHD Graphics Built-in Visuals and the VGA outputs
• 11
th
Gen Intel® Core
TM
Intel® Core Processors (LGA1200)
un-buffered memory
th TM
Gen Intel® Core (i9/i7/i5) support DDR4 up to 3200;
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
th TM
Gen Intel® Core (i9/i7) support DDR4 up to 2933;
TM
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
ECC mode)
can be supported only with processors which are GPU
integrated.
th TM
Gen Intel® Core Processors support Intel® X
Architecture (Gen 12). 10
support Gen 9 Graphics
TM
Processors and 11
th TM
Gen Intel® Core Processors
H510 Pro BTC+
th
Gen
e
Graphics
5