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USB 2.0 Headers
(9-pin USB4_5)
(see p.2, No. 19)
(9-pin USB6_7)
(see p.2, No. 18)
USB 3.0 Header
(19-pin USB3_2_3)
(see p.2, No. 7)
Infrared Module Header
(5-pin IR1)
(see p.2, No. 24)
Front Panel Audio Header
(9-pin HD_AUDIO1)
(see p.2, No. 22)
1. High Defi nition Audio supports Jack Sensing, but the panel wire on the
chassis must support HDA to function correctly. Please follow the
instruction in our manual and chassis manual to install your system.
2. If you use AC'97 audio panel, please install it to the front panel audio
header as below:
A. Connect Mic_IN (MIC) to MIC2_L.
B. Connect Audio_R (RIN) to OUT2_R and Audio_L (LIN) to OUT2_L.
12
Vbus
Vbus
Vbus
IntA_P1_SSRX-
IntA_P0_SSRX-
IntA_P1_SSRX+
IntA_P0_SSRX+
GND
GND
IntA_P1_SSTX-
IntA_P0_SSTX-
IntA_P1_SSTX+
IntA_P0_SSTX+
GND
GND
IntA_P1_D-
IntA_P0_D-
IntA_P1_D+
IntA_P0_D+
DUMMY
IRTX
+5VSB
DUMMY
1
GND
IRRX
GND
PRESENCE#
MIC_RET
OUT_RET
1
OUT2_L
J_SENSE
OUT2_R
MIC2_R
MIC2_L
ASRock B75M-DGS R2.0 Motherboard
Besides four default USB 2.0
ports on the I/O panel, there are
two USB 2.0 headers on this
motherboard. Each USB 2.0
header can support two USB 2.0
ports.
Besides two default USB 3.0
ports on the I/O panel, there is
one USB 3.0 header on this
motherboard. This USB 3.0
header can support two USB 3.0
ports.
This header supports an
optional wireless transmitting
and receiving infrared module.
This is an interface for front
panel audio cable that allows
convenient connection and
control of audio devices.
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