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1.2 Specifications
Platform
• Mini-ITX Form Factor
• Solid Capacitor design
• Supports 10
CPU
• Digi Power design
• 6 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
• Intel® B560
Memory
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 DIMM Slots
• 11
• 10
* 11
Core
* 10
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
11
Expansion
Slot
• 1 x PCI Express 4.0 x16 Slot*
10
• 1 x PCI Express 3.0 x16 Slot*
* Supports NVMe SSD as boot disks
• 1 x Vertical M.2 Socket (Key E) with the bundled WiFi-
th
Gen Intel® Core
TM
Intel® Core
Processors (LGA1200)
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TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 4600+(OC)*
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TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 4400+(OC)*
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TM
Gen Intel® Core
(i9/i7/i5) support DDR4 up to 3200;
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
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TM
Gen Intel® Core
(i9/i7) support DDR4 up to 2933; Core
ECC mode)
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TM
Gen Intel® Core
Processors
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TM
Gen Intel® Core
Processors
802.11ac module (on the rear I/O)
TM
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Processors and 11
Gen
B560M-ITX/ac
TM
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