CARACTERISTICAS / FEATURES
CHANNELS
PCB Layers
TOPOLOGY
Chipset
F/R CH
4 Power Output(CEA)
2 Power Output(CEA)
4 Bridged Power Output(CEA)
SUB CH
1 Power Output(CEA)
2 Power Output(CEA)
4 Power Output(CEA)
TOTAL HARMONIC DISTORTION
SIGNAL/NOISE RATIO
GAIN RANGE
X-OVER RANGE<LPF>
X-OVER RANGE<HPF>
Subsonic FREQUENCY
OPERATION EFFICIENCY
Full Power THERMAL TIME
DAMPING FACTOR
FREQUENCY RESPONSE
BASS BOOST
REMOTE CONTROL
FUSE SIZE
GX TECHNOLOGY
ESPECIFICACIONES TECNICAS
GXP-150.4D
GXP-200.4D
4
4
CLASS-D
IR
150Wx4
250Wx4
500Wx2
/
/
/
<1%
90dB
0.2-6V
40-400Hz
40-400Hz
/
85%
>60MINS
>200
20-20KHz
0-18dB
No
40Ax2
TECHNICAL FEATURES
GXP-450.2D
4
4
CLASS-D
IR
200Wx4
300Wx2
600Wx2
1200Wx1
/
/
/
<1%
90dB
0.2-6V
40-400Hz
20-250Hz
40-400Hz
80-350Hz
/
85%
>60MINS
>60MINS
>200
20-20KHz
20-20KHz
0-18dB
No
40Ax2
2
2
CLASS-D
IR
450Wx2
600Wx2
/
/
/
<1%
90dB
0.2-6V
/
85%
>200
0-18dB
No
30Ax3
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