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ASROCK H55M-LE Manual Del Usuario página 6

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1.2
1.2
1.2
Specifications
Specifications
Specifications
1.2
1.2
Specifications
Specifications
Platform
CPU
Chipset
Memory
Expansion Slot
Graphics *
Audio
LAN
6 6 6 6 6
- Micro ATX Form Factor: 9.6-in x 8.0-in, 24.4 cm x 20.3 cm
- Solid Capacitor for CPU power
®
TM
- Supports Intel
Core
i7 / i5 / i3 and Pentium
Processors in LGA1156 Package
- Supports Intel
®
Turbo Boost Technology (see CAUTION 1)
- Supports Hyper-Threading Technology (see CAUTION 2)
- Supports Untied Overclocking Technology (see CAUTION 3)
- Supports EM64T CPU
®
- Intel
H55
- Dual Channel DDR3 Memory Technology (see CAUTION 4)
- 2 x DDR3 DIMM slots
- Supports DDR3 2600+(OC)/2133(OC)/1866(OC)/1600/
1333/1066 non-ECC, un-buffered memory
- Max. capacity of system memory: 8GB (see CAUTION 5)
- Supports Intel
®
Extreme Memory Profile (XMP)
(see CAUTION 6)
- 1 x PCI Express 2.0 x16 slot (5GT/s at x16 mode)
- 1 x PCI Express 2.0 x1 slot (2.5GT/s)
- 2 x PCI slots
* Requires a Processor with Intel
- Intel
®
HD Graphics
- Pixel Shader 4.0, DirectX 10
- Max. shared memory 1759MB (see CAUTION 7)
- Dual VGA Output options: support DVI-D and D-Sub ports by
independent display controllers
- Supports DVI with max. resolution up to 1920x1200 @ 60Hz
- Supports D-Sub with max. resolution up to 2048x1536 @
75Hz
- Supports HDCP function with DVI port
- Supports Full HD 1080p Blu-ray (BD) / HD-DVD playback with
DVI port
- DVI port can be transferred to a HDMI 1.3 port to support
Deep Color, xvYCC and HBR audio (High Bit Rate Audio)
(Compliant HDMI monitor is required)
- 7.1 CH HD Audio (VIA
®
VT1718S Audio Codec)
- PCIE x1 Gigabit LAN 10/100/1000 Mb/s
- Realtek RTL8111DL
- Supports Wake-On-LAN
ASRock H55M-LE Motherboard
®
G6950
®
Graphics Technology

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