Bonding And Grounding; Installation Notes - Leviton OIP Manual De Instalación Y Guía Del Usuario

INSTALLATION:
The OIP unit must be securely anchored to the floor. The Sub-Floor Mounting Kit is available as a
recommended component for raised floor installations.

BONDING AND GROUNDING

The bonding and grounding lug hole patterns on Leviton OIP accommodate two-hole lugs per the
recommendation of BICSI and ANSI-J-STD-607-A standards. Bonding point areas and thread holes are
protected by cover tape and thread plugs. Remove bonding point thread plugs and cover tape when using this
feature. Install bonding and grounding products per manufacturer recommendation.

INSTALLATION NOTES

• Allow only qualified service personnel to install this frame system
• Each OIP Frame Kit must be secured to the structural floor
• When laid out in a continuous row, the spacing between racks should be determined by an evaluation of the
load requirements. Each installation requirement varies depending on multiple factors such as pathway
products, cable type and size, ancillary equipment to be supported, and many other conditions
• OIP structures are designed to be secured together by use of 1 5/8" x 1 5/8" 12 gauge solid steel channel (not
included). Installation must be by use of channel attachment bracket kit – (Item 2)
• Determine the OIP Frame Kit mounting method, either direct to concrete floor or raised floor and follow
chosen installation method below
• Determine the OIP Frame Kit mounting location. Mark the location of the mounting holes using the Frame
Drill Template (Item 3) as a guide
• Each OIP Upright must be secured with four anchors per upright.
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