jbc AM Serie Manual Del Usuario página 7

SOLDERING PROCEDURE
1 After desoldering the component, any solder
left on the printed circuit should be removed
with our DR-A desoldering iron.
2 Place the component or printed circuit with
the T260-A Pick & Place.
3 When the component is correctly placed,
solder its pins.In the case of integrated circuits
of the Flat Pack type, first solder one pin of
every IC angle to fix it in place in the circuits.
4 Apply FL-15 flux in pads and leads.
5 Solder the remaining pins. For this we
recommend to use our soldering irons of the
JBC series, which are available in two different
models:
T210-A handpiece for great precision tasks,
like SMD solders, etc.
T245-A handpiece for general soldering
tasks in professional electronics.
These soldering irons have a wide range of
cartridges with different models of tips. The
C245-009 cartridge and C245-010 are
specially designed for soldering SMD circuits
of the QFP and PLCC types.
Solder wire with a diameter of between 0.5 and
0.7 mm should be used.
6 Depending on the nature of the component to
be soldered, use soldering paste together
with our TE hot air station, which gives very
accurate air-flow regulation, between 4 and
12 l/min.
6
ENGLISH