ASROCK X99 OC Formula/3.1 Manual Del Usuario página 9

1.2 Speciications
• EATX Form Factor
Platform
• 8 Layer PCB
• 4 x 2oz copper
• High Density Glass Fabric PCB
• Supports Intel® Core
CPU
• Digi Power design
• 12 Power Phase design (Supports up to 1300w)
• Supports Intel® Turbo Boost 2.0 Technology
• Supports Untied Overclocking Technology
• Intel® X99
Chipset
• Quad Channel DDR4 Memory Technology
Memory
• 8 x DDR4 DIMM Slots
• Supports DDR4 3400+(OC)*/2933(OC)/2800(OC)/2400(
* Please refer to Memory Support List on ASRock's website for
• Supports non-ECC x8 (8 bit) RDIMM (Registered DIMM)/
• Supports DDR4 ECC x8 (8 bit) RDIMM/x8 (8 bit) UDIMM
• Max. capacity of system memory: 128GB (see CAUTION)
• Supports Intel® Extreme Memory Proile (XMP) 2.0
• 5 x PCI Express 3.0 x16 Slots (PCIE1/PCIE2/PCIE3/PCIE4/
Expansion
Slot
* If you install CPU with 28 lanes, PCIE1/PCIE2/PCIE3/PCIE4/
PCIE5 will run at x16/x0/x4/x8/x0 or x8/x8/x4/x8/x0, and PCIE5
will be disabled.
* To support 3-Way CrossFireX
CPU with 28 lanes, please install VGA cards to PCIE1/PCIE2/
PCIE4 (x8/x8/x8).
TM
Family for the LGA 2011-3 Socket
OC)/2133 non-ECC, un-bufered memory
more information. (http://www.asrock.com/)
x8 (8 bit) UDIMM
with Intel® Xeon® processors E5 series in the LGA 2011-3
Socket
PCIE5: single at x16 (PCIE1); dual at x16 (PCIE1) / x16
(PCIE4); triple at x8 (PCIE1) / x8 (PCIE2) / x16 (PCIE4);
quad at x8 (PCIE1) / x8 (PCIE2) / x8 (PCIE4) / x8 (PCIE5))
i7 and Xeon® 18-Core Processors
TM TM
and 3-Way SLI
X99 OC Formula/3.1
when using
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