ASROCK Z590 OC Formula Manual Del Usuario página 13

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1.2 Specifications
Platform
• EATX Form Factor
• 12 Layer PCB
• 2oz Copper PCB
CPU
• Supports 10
• Digi Power design
• 16 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
• Supports Intel® K-Series unlocked CPUs
• Supports ASRock Hyper BCLK Engine III
Chipset
• Intel
Memory
• Dual Channel DDR4 Memory Technology
• 2 x DDR4 SMD DIMM Slots
• 11
• 10
* 11
Core
* 10
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
• Max. capacity of system memory: 64GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
th
Gen Intel® Core
TM
Intel® Core
Processors (LGA1200)
®
Z590
th
TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 5600+(OC)*
th
TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 5000+(OC)*
th
TM
Gen Intel® Core
(i9/i7/i5) support DDR4 up to 3200;
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
th
TM
Gen Intel® Core
(i9/i7) support DDR4 up to 2933; Core
ECC mode)
Z590 OC Formula
TM
th
Processors and 11
Gen
TM
9

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