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1.2 Specifications
Platform
• Micro ATX Form Factor
• Solid Capacitor design
• Supports 10
CPU
• Digi Power design
• 8 Power Phase design
• Supports Intel® Turbo Boost Max 3.0 Technology
Chipset
• Intel® H570
Memory
• Dual Channel DDR4 Memory Technology
• 4 x DDR4 DIMM Slots
• 11
• 10
* 11
Core
* 10
(i5/i3), Pentium® and Celeron® support DDR4 up to 2666.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Supports ECC UDIMM memory modules (operate in non-
• Max. capacity of system memory: 128GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
11
Expansion
Slot
• 1 x PCI Express 4.0 x16 Slot (PCIE1)
10
• 1 x PCI Express 3.0 x16 Slot (PCIE1)
* Supports NVMe SSD as boot disks
• 1 x PCI Express 3.0 x4 Slot
• 1 x PCI Express 3.0 x1 Slot
• Supports AMD Quad CrossFireX
• 1 x M.2 Socket (Key E), supports type 2230 WiFi/BT module
th
Gen Intel® Core
TM
Intel® Core
Processors (LGA1200)
th
TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 4800+(OC)*
th
TM
Gen Intel® Core
Processors support DDR4 non-ECC,
un-buffered memory up to 4600+(OC)*
th
TM
Gen Intel® Core
(i9/i7/i5) support DDR4 up to 2933;
TM
(i3), Pentium® and Celeron® support DDR4 up to 2666.
th
TM
Gen Intel® Core
(i9/i7) support DDR4 up to 2933; Core
ECC mode)
th
TM
Gen Intel® Core
Processors
th
TM
Gen Intel® Core
Processors
and Intel® CNVi (Integrated WiFi/BT)
TM
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Processors and 11
Gen
TM
TM
and CrossFireX
H570M Pro4
TM
5
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