Descargar Imprimir esta página

Grundig Beat Boy 280 Manual De Servicio página 5

Publicidad

cry
Canada
Safety Instructions
The lightning flash with arrowhead symbol within an equilate-
A
ral triangle is intended to alert the user to the presence of
uninsulated "dangerous voltage" within the product's encio-
sure that may be of sufficient magnitude to constitute a risk of
electric shock to persons.
The exclamation pointwithin an equilateral triangle is intended
A
to alert the user to the presence of important operating and
maintenance (servicing) instructions in the literature accom-
panying the appliance.
This product was designed and manufactured to meet
strict quality and safety standards. There are, however,
some installation and operation precautions which you
should be particularly aware of.
Read Instructions
- All the safety and operating instructions
should be read before the appliance is operated.
Retain Instructions - The safety and operating instructions
should be retained for future reference.
Heat Warnings - All warnings on the appliance and in the ope-
rating instructions should be adhered to.
Follow Instructions - All operating and handling instructions
should be followed.
Water and Moisture - The appliance should not be used near
water - for example, near a bathtub, washbowl, kitchen sink,
laundry tub, in a wet basement, or near a swimming pool, and
the like.
Wall or Ceiling Mounting - The appliance should be mounted
to wall or ceiling only as recommended by the manufacturer.
@
Ventilation - The appliance should be situated so that its loca-
tion or position does not interfere with its proper ventilation.
For example, the appliance should not be situated on a bed,
sofa, rug, or similar surface that may block the ventilation
openings; or, placed in a built-in installation, such as a
bookcase or cabinet that may impede the flow of air through
the ventilation openings.
@
Heat - The appliance should be situated away from heat
sources such as radiators, heat registers, stoves, or other
appliances (including amplifiers) that produce heat.
@
Power Sources - The appliance should be connected
to a
power supply only of the type given above or as marked on
the appliance.
@
Power Cord Protection - Power supply cords should be routed
so that they are not likely to be walked on or pinched by items
placed upon or against them, paying particular attention to
cords at plugs, convenience receptacles, and the point where
they exit from the appliance.
@
Cleaning - The appliance should be cleaned only as recom-
mended by the manufacturer.
@
Power Lines - An outdoor antenna should be located
x1
away from power lines.
@
Outdoor Antenna Grounding - If an outside antenna is
x2
connected to the receiver, be sure the antenna system is
grounded so as to provide some protection against voltage
surges and built up static charges. Section 810 of the National
Electrical Code, ANSI / NFPA No. 70-1984, provides informa-
tion with respect to proper grounding of the mast and suppor-
ting structure, grounding of the lead-in wire to an antenna
discharge unit, size of grounding
conductors,
location
of
antenna discharge unit, connection to grounding electrodes,
and requirements for the grounding electrode.
@
Nonuse Periods - The power cord of the appliance should be
unplugged from the outlet when left unused fora long period
of time.
@
Object and Liquid Entry - Care should be taken so that objects
do not fall and liquids are not spilled into the enclosure through
openings.
@
Damage Requiring Service - The appliance should be servi-
ced by qualified service personnel when: the power-supply
cord or the plug has been damaged; or objects have fallen,
or liquid has been spilled into the appliance; or the appliance
has been exposed to rain; or the appliance does not appear
to operate normally or exhibits a marked change in perfor-
mance; or the appliance has been dropped, or the enclosure
damaged;
or the batteries have been damaged.
@
Servicing - the user should not attempt to service the applian-
ce beyond that described in the operating
instructions. All
other servicing should be referred to qualified service person-
nel .
Points x1 and x2 apply only to receivers or tuners.
CD CHIP Technik
Aus- und Einidten von CHIP-Bautelien
-
Verwenden Sie nur einen Niedervoltlétkolben mit Temperatur-
regelung.
-
Die Léttemperatur sollte ca. 240 °C betragen (max. 300 °C).
-
Halten Sie die Létzeit so kurz wie méglich.
-
Belassen Sie CHIP-Bauteile bis zur Bearbeitung in der Original-
verpackung. Damit wird die Oxidation der Stirnkontakte ver-
mieden.
-
Berdhren Sie CHIP- Bauteile nicht mit der bloBen Hand.
Ausldten von CHIP-Bautellen
1. Schritt: CHIP- Létstelle mit Sauglitze absaugen (Fig. 1).
2.
Schritt: CHIP-Enden, bzw. das komplette CHIP-Bauteil erwar-
men. CHIP von der Klebung ohne Kraftaufwand abdre-
hen, damit unter dem CHIP liegende Leiterbahnen nicht
abgerissen werden (Fig. 2).
Achtung!
Ausgelétetes CHIP nicht wiederverwenden!
Die leltende Schicht kann ausgebrochen sein.
Einidten von CHIP-Bautellen
3. Schritt:
Létpunkt von Létrickstanden saubern. Létperie anbrin-
gen (Fig. 3).
4. Schritt;
CHIP an der Létstelle ansetzen, zentrieren und anléten
(Fig. 4).
5. Schritt:
Freie Seite l6ten. Nach dem Erkalten die erste Létstelle
nochmais nachldten (Fig. 5).
CHIP Technology
Soldering and unsoldering of CHIP components
-
Use only low-voltage soldering irons with temperature control.
-
Permissible soldering temperatures are approx. 240 °C up to
max. 300 °C.
-
Keep the soldering period as short as possible.
-
Keep the CHIP components in their original packages until they
are used to avoid oxidation of the end contacts.
-
Donottouch CHIP components with bare hands.
Unsoldering of CHIP components
1. step: Clean the CHIP soldering point with a solder wick (Fig. 1).
2. step: Warm up the ends of the CHIP or the whole CHIP compo-
nent and remove the CHIP from the adhesive by turning it
without application of force so that the tracks beneath the
CHIP do not break (Fig. 2).
Attention!
Do not use unsoldered CHIPS any more!
The conductive layer may be broken.
Soldering of CHIP components
3. step: Remove possible residues from the soldering point. Then
apply a solder bead (Fig. 3).
4. step: Put the CHIP onto the soldering point, then center and fix it
(Fig. 4).
5. step: Solder the free end of the CHIP and resolder the first soldering
point after it has cooled (Fig. 5).

Publicidad

loading