jbc ADVANCED Serie Manual Del Usuario página 5

ENGLISH
DESOLDERING PROCEDURE WITH THE
HEATER
We would also recommend the use of the nozzles of
larger diameter, reserving the smallest one (diam. 4
mm) for desoldering small components such as
resistors, condensers and the like, bearing in mind
that with this small nozzle the concentration of heat
is greater and care must be taken to avoid burning
the printed circuit; we recommend keeping below a
temperature of 350 °C and air flow of 6.
Depending on the size of the integrated circuit to be
desoldered, you will have to use:
A ) Protector + tripod.
B) Extractor.
C) Tripod.
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
- Use the VACUUM button to start the pump and
then fit the tripod. Press the sucker down until it
sticks onto the component.
- Use the pedal or the HEAT button to start the
self-contained hot-air pump, directing it with a
circular movement at the component terminals
and taking care to distribute the heat evenly.
- When the soldering flux turns liquid the extractor
will automatically lift the component.
B) Extractor:
- Select extractor size in function of the IC to be
desoldered. Use the VACUUM button to start
the pump.
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