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Operating via AMS Device Manager
AMS Device Manager is a software package designed to commission and maintain field devices.
Please consult the operating instructions or online help for details on using AMS Device
Manager. You can find more information at: http://www.emersonprocess.com/AMS/.
Electronic Device Description (EDD)
SITRANS LR200 requires the EDD for AMS Device Manager version 9.0.
Configuring a new device via AMS Device Manager
1)
Check the product page of our website at: www.siemens.com/LR200 to make sure you
have the most recent EDD. Go to Support > Software Downloads and if necessary
download it. Save the files to your computer, and extract the zipped file to an easily
accessed location.
2)
Launch AMS Device Manager– Add Device Type, browse to the unzipped EDD file and
select it.
Launch AMS Device Manager. An Application Guide for setting up HART devices with AMS
Device Manager can be downloaded from the product page of our website under Support.
Maintenance
SITRANS LR200 requires no maintenance or cleaning under normal operating conditions. If
cleaning becomes necessary under severe operating conditions:
1)
Note the antenna material and the process medium, and select a cleaning solution that
will not react adversely with either.
2)
Remove the device from service and wipe the antenna clean using a cloth and suitable
cleaning solution.
Unit Repair and Excluded Liability
For detailed information, please see the inside back cover.
Maximum Process Temperature Chart
WARNING: Internal temperature must not exceed 80 °C (176 °F).
Notes:
• The chart is for guidance only and does not represent every possible process connection
arrangement. (It will NOT apply if SITRANS LR200 is mounted directly on a metallic vessel
surface.)
• The chart does not take into consideration heating from direct sunshine exposure.
• Parameter 3.2. 1 Current Internal Temperature monitors the internal temperature.
Flange Adapter versions of SITRANS LR200
A5E31993614
process
temperature
SITRANS LR200 (HART) – QUICK START MANUAL
Maximum Process
Temperatures versus
allowable ambient
o
Process Temperature (
C)
Page EN-21

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