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1. Description
1.1 Control Unit
The WDD80V Desoldering Station is member of a family of equipment developed for industrial
manufacturing, as well as for the repair and laboratory sectors. Straightforward, easy operation
is made possible by the use of a microprocessor. The digital control electronics ensure opti-
mal regulation behaviour with different soldering tools. The soldering tools themselves are
detected automatically and assigned the appropriate control parameters. The vacuum required
for desoldering is generated by an internal maintenance-free compressed air converter and
is activated via an integrated finger switch on the desoldering tool.
Various methods of equipotentially bonding the soldering iron bit, a zero voltage switch, and
the anti-static design of the control unit and soldering tools supplement the high standard of
the unit. The possibility of connecting an external input unit extends the functional diversity
of this desoldering station. Additional functions including timing and interlocking can be
realised using the WCB 1 and WCB 2 Input Units, available as optional extras. The extended
features of the WCB 2 Input Unit include an integrated temperature measurement unit and a
PC interface.
The required temperature can be set via 2 buttons (Up/Down) over the range from 50 ºC -
450 ºC (122 ºF - 842 ºF). Required and actual values are displayed digitally. A flashing red
LED in the display indicates when the selected temperature is reached, this LED serves as
an optical regulation monitor. The continuous illumination of the LED indicates that the system
is warming up.
1.2 Soldering tools
DS 80:
80 W Desoldering Tool. A wide range of suction nozzles enables solder to be
removed from a wide variety of solder joints. The tin collection container can
be changed easily without the need for tools. CSF desoldering plungers for
the desoldering of surface mounted components are available as accessories.
Integrated finger switch for activating the vacuum.
DS V 80:
80 W Desoldering Tool. In-line version (vertical work position). Tin collection
container integrated into the handle can be changed easily without the need
for tools. Wide range of CSF (SMD desoldering plungers) and suction nozzles.
The vacuum is activated by means of a finger switch.
WDD 80V 07/00
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LR 21:
Our "standard" soldering iron. With a power of 50 watts and a wide spectrum
GB
of soldering tips (ET series) this soldering iron can be used anywhere in the
electronics sector.
MLR 21:
With its 25-watt power and slim design, this micro-soldering iron is especially
well-suited for fine soldering work with a low heating requirement.
WTA 50:
The unsoldering tweezers WT 50 were specially designed for unsoldering
SMD components. Two heating elements (2 x 25 watts), each with its own
temperature sensor, ensure constant temperatures at both ends.
LR 82:
High-performance 80 watt soldering iron for soldering work with high heat
requirements. The soldering tip is attached by a bayonet catch to ensure
correct position when using different tips.
WSP 80:
The soldering iron WSP 80 is characterized by its capacity for reaching the
soldering temperature quickly and precisely. Its slim design and heating power
of 80 watts makes universal usage possible - from extremely fine to high-
temperature soldering work. Work can be continued immediately after
switching soldering tips, since the temperature is reached again quickly.
See "Accessories" for additional tools.
Technical Data
Dimensions (mm):
180 (L) x 115 (W) x 101 (H)
(in)
7,1 (L) x 4.53 (W) x 4 (H)
Mains Voltage (9):
230 V / 50 Hz, 120 V / 60 Hz (see rating plate)
Power Consumption:
95 W
Protection Class:
1 (Control Unit) and 3 (Soldering Tool)
Fuse (10):
T 500 mA (230 V); T 1 A (120 V) (see rating plate)
Temperature Regulation:
Digital 50 ºC - 450 ºC (122 ºF - 842 ºF)
Precision:
± 9 ºC (± 17 ºF)
Compressed Air:
Inlet pressure 600 kPa (87 psi), oil-free, dry compressed air
Compressed Air Converter:
Air consumption 35 l/min; max. vacuum 55 kPa (8 psi)
Compressed Air Connection: Compressed air hose of 6 mm (0.24") external diameter
Equipotential Bonding:
Via 3.5 mm switched jack socket on the rear of the unit (as
supplied directly earthed)
04.04.2002, 10:49 Uhr
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