ASROCK X299 Creator Manual De Instrucciones página 15

1.2 Specifications
Platform • ATX Form Factor
• 8 Layer PCB
• 2oz Copper PCB
CPU • Supports Intel® Core
• Digi Power design
• 13 Power Phase design
• Supports Intel® Turbo Boost Max Technology 3.0
Chipset • Intel® X299
Memory • Quad Channel DDR4 Memory Technology
• 8 x DDR4 DIMM Slots
• Supports DDR4 4200+(OC)*/4000(OC)/3800(OC)/
* The maximum memory frequency supported may vary by
processor type.
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
• Max. capacity of system memory: 256GB
• Supports Intel® Extreme Memory Profile (XMP) 2.0
• 15μ Gold Contact in DIMM Slots
Expansion • 4 x PCI Express 3.0 x16 Slots*
Slot * If you install CPU with 48 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x8/x16/x8.
If a M.2 PCI Express module is installed on M2_1 or M2_2,
PCIE2 will downgrade to x4 mode.
If M.2 PCI Express modules are installed on M2_1 and M2_2,
PCIE2 will be disabled.
* If you install CPU with 44 lanes, PCIE1/PCIE2/PCIE3/PCIE5
will run at x16/x4/x16/x8.
If a M.2 PCI Express module is installed on M2_1, PCIE2 will
be disabled.
TM
X-Series Processor Family for the
LGA 2066 Socket (Cascade Lake-X, Skylake X Refresh and
Skylake X)
3733(OC)/3600(OC)/3200(OC)/2933(OC)/2800
(OC)/2666/2400/2133 non-ECC, un-buffered memory
X299 Creator
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