jbc TE 5400 Manual Del Usuario página 7

Process for printed circuits in PLCC, QFP, SO
encapsulations:
1) Temperature of about 350°C (662°F), air
flowrate 1-7.
SEL T
350ºC
2) Apply soldering cream (*) for SMD on the
circuit pads, forming a bead transverse to
the direction of the tracks. In this operation,
it is vital not to apply too much cream,
since any excess may lead to solder
cross-connections being formed between
the component's pins.
3) Take the component with the PK 6060 or DP
6070 Pick & Place, place it in position on the
circuit and hold it in place.
4) Use the heater like the previous case,
advancing slowly from one extreme to
another of the pins line.
(*) Alloy 62 Sn/ 36 Pb/ 2 Ag Type RMA/CMA.
AIR SELt
50% 2:00
For desoldering
Temperature from 400 to 450°C (752 to 842°F),
an air flowrate from 7 to maximum, depending
on the size of the component.
SEL T
400ºC
Depending on the size of the integrated circuit
to be desoldered, you will have to use:
A) Protector + tripod.
B) Extractor.
C) Tripod.
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
- Use the SUCTION button to start the pump
and then place the tripod. Press the suction
cup until it sticks onto the component.
- Use the pedal or the HEAT button to start the
self-contained hot-air pump, directing it with a
circular movement at the component terminals
and taking care to distribute the heat evenly.
- When the soldering flux turns liquid the
extractor will automatically lift the component.
B) Extractor:
- Select extractor size in function of the IC to
be desoldered. Use the SUCTION button to
start the pump.
- Place the extractor and press the suction cup
until it sticks onto the component.
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ENGLISH
AIR SELt
50% 2:00