Star TSP700 Serie Manual De Usuario página 11

Specifications
Printing method
Dot density
Printing direction
Printing width
Character per line (default)
Character spacing (default)
Character size
Character set
Print speed
Line spacing
Character structure
Interface
Received buffer size
MCBF
Cutter life
Temperature
Humidity
Dimension
Weight
Options
(1) Wall Mount Set (WB-T700)
(2) Vertical Stand Set (VS-T700)
(3) USB Interface Board Unit (IFBD-HU03)
(4) Parallel Interface Board Unit (IFBD-HC03)
(5) 25 Pin RS-232C Interface Board Unit (IFBD-HD03)
(6) 9 Pin RS-232C Interface Board Unit (IFBD-HN03)
(7) Ethernet Interface Board Unit (IFBD-HE03)
Please access the following URL
http://www.star-micronics.co.jp/service/frame_sp_spr_e.htm
for the lastest printer drivers and utilities.
Thermal line printing
203dpi x 203 dpi (8 dot/mm)
Unidirectional with friction feed
Max. 80mm (640 dots)
Font A: 42, Font B: 56
0 dot
Font A: 1.5 x 3.0 mm
Font B: 1.125 x 3.0 mm
Alphanumeric characters: 95
International characters: 32
External graphics: 128 x 40 pages
Max. 180 mm/sec
3mm / 4mm
Font A: 12 x 24
Font B: 9 x 24
RS232C / IEEE1284 / USB / Ethernet
8K / 64 bytes
60 million lines
(based on an average printing rate of 12.5% with
paper thickness in the range 65 µ m to 75 µ m)
1 million (65-100 µ m thick paper)
0.3 million cutting (100 to 150 µ m thick paper)
Operating: 5 to 45 °C
Storage: -20 to 60 °C
Operating: 10 to 90% RH (without condensation)
Storage: 10 to 90% RH (without condensation)
147 x 213 x 148 (W x D x H mm)
Approx. 1.7 Kg
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