jbc ADVANCED Serie Manual Del Usuario página 5

ENGLISH
For soldering
Process for small SMD components of two or
three pins such as heating elements, capacitors,
transistors, etc:
1) If the component has been desoldered
previously, any traces of solder left on the
circuit pads must be cleaned up by
desoldering iron suction. We recommend our
desoldering stations AR 5800 and DS 5300.
2) Temperature 300°C (572°F), air flowrate 1-2.
3) Apply soldering cream (*) for SMD on the
circuit pad. For application we recommend our
model DP 6070 dispenser or any other available
on the market.
The amount of cream used for each soldering
operation should be just sufficient to cover the
trace of the component pin. Any excess cream
may extend over the circuit on melting and
cause short-circuits.
4) Take the component with a JBC PK 6060 or
DP 6070 Pick & Place or otherwise with fine
pincers, place it in position on the circuit and
hold it in place.
5 ) Move the nozzle tip to about 15-20 mm
from the component terminal and direct
the hot air flow against it. Wait for a few
seconds until the cream flux liquefies.
During this time the terminal will be
preheated to about 100°C (212°F). Move
the tip closer to 8-10 mm and hold it just
until the tin alloy melts. Immediately remove
the heater. If the solder area is overheated,
it oxidizes making soldering difficult and
there is a risk of damaging the component
or the printed circuit copper adhesive.
4