jbc ADVANCED Serie Manual Del Usuario página 6

Process for printed circuits in PLCC, QFP, SO
encapsulations:
1) Temperature of about 350°C (662°F), air flowrate
1-7.
2) Apply soldering cream (*) for SMD on the
circuit pads, forming a bead transverse to
the direction of the tracks. In this operation,
it is vital not to apply too much cream, since
any excess may lead to solder cross-
connections being formed between the
component's pins.
3) Take the component with the PK 6060 or DP
6070 Pick & Place, place it in position on the
circuit and hold it in place.
4) Use the heater like the previous case,
advancing slowly from one extreme to another
of the pins line.
(*) Alloy 62 Sn/ 36 Pb/ 2 Ag Type RMA/CMA.
For desoldering
Temperature from 400 to 450°C (752 to 842°F), an
air flowrate from 7 to maximum, depending on the
size of the component.
Depending on the size of the integrated circuit to
be desoldered, you will have to use:
A) Protector + trípod.
B) Extractor.
C) Trípod.
A) Protector + tripod:
- Select protector and tripod size in function of
the IC to be desoldered and place it over the
component.
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ENGLISH